Tweezers

Our chip-die carriers are made from antistatic compound that has very good volume resistivity together with a good balance of physical and mechanical properties. We are also able to provide electrically conductive wafer packs.

They are designed 2" x 2", 4" x 4" and can be customized to other sizes according to our customers requirements. Our trays meets the dimensions stated in our drawing prints.

C-Pak is ever ready to work concurrently (concurrent engineering) with our customers to develop parts that solve our customers’ problems.

The chip carriers are recommended for die packaging and product handling applications where accurate dimensional stability and freedom form the hazard of ESD is important.

These products are used mostly in the semiconductor dicing and disk drive head (slider head) dicing operations.The chip carriers are designed to protect die chips during process handling as well as for shipping purposes.

For the MR head slider fabrication process, we are able to provide chip carriers with the following capabilities :

• Short leadtime / turnaround time
• Economical pricing
• Good dimensional controlled trays
• Low warppage / very flat trays
• ESD safe
• Non-sloughing (if required)
• HDT capability of > 150 degree Celcius
• No Silicone, Amide, DOP and with extremely low level of chlorine and NVR contents

Specially customised tooling specifications are also available.